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Material or Process Book or Chapter Title Author or Editor Publication dates

3D Integration in VLSI Circuits

Implementation Technologies and Applications

Edited by: Katsuyuki Sakuma , Krzysztof Iniewski

Print publication date:  April  2018
Online publication date:  April  2018

Print ISBN: 9781138710399
eBook ISBN: 9781315200699
Adobe ISBN:

10.1201/9781315200699
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Book description

Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world?s leading scientists and experts from academia, research institutes, and industry from around the globe.

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