Abstract

The modern integrated circuit (IC), comprising memory, logic processors and analog function devices, are multicomponent and multilevel nanostructures prepared by a series of patterning and pattern-transfer steps. Figure 19.1 shows the cross-sectional hierarchical structure that starts from the smallest feature, the transistor, to dielectrics and metal contacts that are each well defined and must precisely overlay the previous layer. This three-dimensional nanoelectronics structure is manufactured by a rapid patterning process called lithography.