ABSTRACT

Incorporating a semiconductor device model into a SPICE [1] simulator has never been easy. Formulating a behavior by observing results from measurements or technology computer-aided design (TCAD) is at the same time science, nuance, and art. Fortunately, advances in modeling tools and methods have improved the quality and timely delivery of compact model enhancements in recent years, relegating some of the modeling mechanics to automation. This chapter chronicles the progress in compact model automation and how this automation has been used to extend the application of compact models into the design of circuits for extreme environments.