ABSTRACT
The field of electronics packaging ranges from the packaging of a single semiconductor die to the electrical, thermal, mechanical, and physical implementation of an electronic system. An example of a single chip packaged die is shown in Figure 66.1. The package provides mechanical and chemical protection for the die, a means of electrically interconnecting to the die at the next level of system integration and a path for internally generated heat removal. Multiple semiconductor packages are then interconnected on a printed circuit board (PCB) with passive and other components to build a higher-level function (Figure 66.2). Often multiple circuit board assemblies are required to complete the system function. (a) Photograph of a Quad Flat Pack (QFP)—plastic package and (b) x-ray image showing internal structure. https://s3-euw1-ap-pe-df-pch-content-public-u.s3.eu-west-1.amazonaws.com/9781315216911/9fc10d54-04ca-4e8b-af21-9892cbc5b25d/content/fig66_1.tif"/> Conventional temperature range printed circuit board assembly. https://s3-euw1-ap-pe-df-pch-content-public-u.s3.eu-west-1.amazonaws.com/9781315216911/9fc10d54-04ca-4e8b-af21-9892cbc5b25d/content/fig66_2.jpg"/>
